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Epoxy Encapsulant and Protective Coating Resin
Electronics & Electrical // Dielectric Potting
Hermetic Environmental & Dielectric Isolation
Precision-formulated using high-purity liquid epoxy resin 128 and specialized polyetheramine/cycloaliphatic hardeners. Engineered to flow seamlessly into micro-cavities around sensitive SMD components, curing into an impervious barrier that resists moisture ingress, chemical vapors, and mechanical vibration.
✓ Superior Dielectric Strength: Dielectric breakdown ≥ 22 kV/mm prevents arcing and signal leakage
✓ Minimal Linear Shrinkage: < 0.15% volume shrinkage minimizes internal stress on delicate soldered ICs
✓ Wide Thermal Cycle Envelope: Continuous operational stability from -40°C up to +130°C
Technical Grade Selection Matrix
Select formulations based on dielectric requirements, thermal dissipation needs, and dispensing automation parameters.
| Product Grade | Appearance | Mix Viscosity (@25°C) | Dielectric Strength | Thermal Conductivity | Primary Applications |
|---|---|---|---|---|---|
| EP-101 Optical Clear | Water-White Transparent | 400 – 600 mPa·s | ≥ 20 kV/mm | 0.25 W/m·K | Optical sensors, LED encapsulation, PCB solder inspection |
| EP-201 Flame Retardant | Opaque Black (UL94 V-0) | 1,200 – 1,800 mPa·s | ≥ 24 kV/mm | 0.65 W/m·K | Switching power supplies, EV on-board chargers, ignition coils |
| EP-301 High Thermal | Industrial Gray | 2,500 – 3,500 mPa·s | ≥ 22 kV/mm | 1.20 W/m·K | High-wattage transformers, motor stators, solar inverters |
| EP-401 Semi-Flexible | Dark Amber / Translucent | 800 – 1,200 mPa·s | ≥ 20 kV/mm | 0.35 W/m·K | Automotive sensors, pressure transducers, thermal shock parts |
Dispensing & Environmental Processing Protocols
Precision operational guidelines tailored for automated meter-mix dispensing and manual batch casting lines:
- Vacuum De-aeration Pre-Treatment: Degas mixed resin under vacuum (1–5 mbar) for 3–5 minutes to eliminate entrapped micro-air before dispensing.
- Substrate & Mold Pre-Heating (40°C–50°C): Pre-heating the component housing lowers potting resin viscosity, enabling rapid capillary infiltration into narrow windings.
- Optimized Viscosity & Flow Rate: Mixed viscosity engineered from 400 to 1,500 mPa·s ensuring air bubbles self-evacuate before the gel point.
- Stepped Curing Schedule: Room temperature curing (24 hrs) or accelerated thermal curing (2 hrs @ 60°C + 1 hr @ 80°C) for maximum crosslinking density.
EP-100 Clear Dome & Conformal Coating
Unfilled optical-clear 2:1 formulation with high surface tension. Designed for self-leveling 3D doming on badges, automotive decals, and moisture conformal sealing of printed circuit boards (PCB).
EP-200 High-Dielectric Potting Compound
Mineral-filled 4:1 black/gray formulation delivering flame retardancy, low thermal expansion (CTE), and superior shock dampening for power supplies, EV sensors, and high-voltage transformers.
Download Encapsulant Selection Guide & TDS Package
Access volume resistivity test charts, dielectric constant data, and bulk drum/pail OEM packaging specifications.